? semiconductor components industries, llc, 2010 september, 2010 ? rev. 1 1 publication order number: 7sb3126/d 7sb3126 bus switch the 7sb3126 bus switch is an advanced high ? speed line switch in ultra ? small footprint. features ? high speed: t pd = 0.25 ns (max) @ v cc = 4.5 v ? 3 switch connection between 2 ports ? power down protection provided on inputs ? ultra ? small packages ? these are pb ? free devices figure 1. logic diagram figure 2. tsop ? 5/sc ? 88a (top view) b a oe oe a gnd v cc b 1 2 3 5 4 oe a gnd v cc b nc 1 2 3 6 5 4 figure 3. ullga6/udfn6 (top view) function table input oe function l disconnect h b = a see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information marking diagrams http://onsemi.com 1 1 1 ullga6 1.0 x 1.0 case 613ad ullga6 1.2 x 1.0 case 613ae ullga6 1.45 x 1.0 case 613af j m 1 5 1 5 af m (note: microdot may be in either location) aj, af, j, 6, a, k = specific device code m = date code = pb ? free package sot23 ? 5/tsop ? 5/sc59 ? 5 dt suffix case 483 sot ? 353/sc70 ? 5/sc ? 88a df suffix case 419a 1 5 aj m m m 1 5 udfn6 1.2 x 1.0 case 517aa k m 1 6 a
7sb3126 http://onsemi.com 2 table 1. maximum ratings symbol parameter value unit v cc dc supply voltage ? 0.5 to +7.0 v v in control pin input voltage ? 0.5 to +7.0 v v i/o switch input / output voltage ? 0.5 to +7.0 v i ik control pin dc input diode current v in < gnd ? 50 ma i ok switch i/o port dc diode current v i/o < gnd ? 50 ma i o on ? state switch current 128 ma continuous current through v cc or gnd 150 ma i cc dc supply current per supply pin 150 ma i gnd dc ground current per ground pin 150 ma t stg storage temperature range ? 65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance sc70 ? 5/sc ? 88a (note 1) tsop ? 5 ullga6/udfn6 350 230 496 c/w p d power dissipation in still air at 85 c sc70 ? 5/sc ? 88a (note 1) tsop ? 5 ullga6/udfn6 150 200 252 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in v esd esd withstand voltage human body mode (note 2) machine mode (note 3) charged device mode (note 4) >2000 >200 n/a v i latchup latchup performance above v cc and below gnd at 85 c (note 5) 100 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ounce copper trace no air flow. 2. tested to eia/ jesd22 ? a114 ? a 3. tested to eia/ jesd22 ? a115 ? a 4. tested to jesd22 ? c101 ? a 5. tested to eia / jesd78. table 2. recommended operating conditions symbol parameter min max unit v cc positive dc supply voltage 4.0 5.5 v v i control pin input voltage 0 5.5 v v i/o switch input / output voltage 0 5.5 v t a operating free ? air temperature ? 55 +125 c t / v input transition rise or fall rate control input switch i/o 0 0 5 dc ns/v
7sb3126 http://onsemi.com 3 table 3. dc electrical characteristics symbol parameter conditions v cc (v) t a = 25 c t a = ? 55 c to +125 c unit min typ max min max v ik clamp diode voltage i in = ? 18 ma 4.5 ? 1.2 ? 1.2 v v ih high ? level input voltage (control) 4.0 to 5.5 2.0 2.0 v v il low ? level input voltage (control) 4.0 to 5.5 0.8 0.8 v i in input leakage current 0 v in 5.5 v 5.5 0.1 1.0 a i off power off leakage current v i/o = 0 to 5.5 v 0 0.1 1.0 a i cc quiescent supply current i o = 0, v in = v cc or 0 v 5.5 0.1 1.0 a i cc increase in supply current (control pin) one input at 3.4 v; other inputs at v cc or gnd 5.5 2.5 ma r on switch on resistance v i/o = 0, i i/o = 64 ma i i/o = 30 ma 4.5 3 3 7 7 7 7 v i/o = 2.4, i i/o = 15 ma 4.5 6 15 15 v i/o = 2.4, i i/o = 15 ma 4.0 10 20 20 table 4. ac electrical characteristics symbol parameter v cc (v) test condition t a = 25 c t a = ? 55 c to +125 c unit min typ max min max t pd propagation delay, a to b or b to a 4.0 to 5.5 see figure 3 0.25 0.25 ns 0.25 0.25 t en output enable time 4.5 to 5.5 0.8 2.5 4.2 0.8 4.2 ns 4.0 0.8 3.0 4.6 0.8 4.6 t dis output disable time 4.5 to 5.5 0.8 3.1 4.8 0.8 4.8 ns 4.0 0.8 2.9 4.4 0.8 4.4 c in control input capacitance 5.0 v in = 3 v or 0 2.0 pf c io(on) switch on capacitance 5.0 switch on 10 pf c io(off) switch off capacitance 5.0 switch off 3.5 pf
7sb3126 http://onsemi.com 4 ac loading and waveforms figure 4. load circuit and voltage waveforms 500 c l = 50 pf (see note a) 7 v from output under test 500 s1 open gnd load circuit test s1 t pd t plz /t pzl t phz /t pzh open 7 v gnd input 1.5 v 1.5 v 1.5 v 1.5 v t plh t phl output 3 v v oh 0 v v ol voltage waveforms propagation delay times t pzl 3 v 1.5 v 1.5 v 0 v output control t plz t pzh t phz 1.5 v 1.5 v 3.5 v 0 v v ol v oh v ol + 0.3 v v oh ? 0.3 v output waveform 1 s1 at 7 v (see note b) output waveform 2 s1 at open (see note b) voltage waveforms enable and disable times a. c l includes probe and jig capacitance. b. waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output contro l. waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output cont rol. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 , t r 2.5 ns, t f 2.5 ns. d. the output is measured with one input transition per measurement. e. t plz and t phz are the same as t dis . f. t pzl and t pzh are the same as t en . g. t plh and t phl are the same as t pd . device ordering information device package shipping ? 7sb3126dtt1g tsop ? 5 (pb ? free) 3000 / tape & reel 7sb3126dft2g sc ? 88a (pb ? free) 3000 / tape & reel 7sb3126amx1tcg ullga6 ? 0.5 mm pitch (pb ? free) 3000 / tape & reel 7sb3126bmx1tcg ullga6 ? 0.4 mm pitch (pb ? free) 3000 / tape & reel 7SB3126CMX1TCG ullga6 ? 0.35 mm pitch (pb ? free) 3000 / tape & reel 7sb3126mutcg udfn6 ? 0.4 mm pitch (pb ? free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
7sb3126 http://onsemi.com 5 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a ? 01 obsolete. new standard 419a ? 02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ? b ? sc ? 88a, sot ? 353, sc ? 70 case 419a ? 02 issue j
7sb3126 http://onsemi.com 6 package dimensions tsop ? 5 case 483 ? 02 issue h notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a 3.00 bsc b 1.50 bsc c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 l 1.25 1.55 m 0 10 s 2.50 3.00 123 54 s a g l b d h c j 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 t seating plane 0.05 k m detail z detail z
7sb3126 http://onsemi.com 7 package dimensions udfn6 1.2x1.0, 0.4p case 517aa ? 01 issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 10x a a1 (a3) 0.08 c 0.10 c c seating plane side view l2 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.127 ref b 0.15 0.25 d 1.20 bsc e 1.00 bsc e 0.40 bsc l 0.30 0.40 l1 0.00 0.15 mounting footprint* dimensions: millimeters 0.22 6x 0.42 6x 1.07 0.40 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. l1 detail a bottom view (optional) 0.40 0.50
7sb3126 http://onsemi.com 8 package dimensions ullga6 1.0x1.0, 0.35p case 613ad ? 01 issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 note 4 soldermask defined* dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.35 1 mounting footprint pkg outline
7sb3126 http://onsemi.com 9 package dimensions ullga6 1.2x1.0, 0.4p case 613ae ? 01 issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.20 bsc e 1.00 bsc e 0.40 bsc l 0.25 0.35 l1 0.35 0.45 note 4 soldermask defined* dimensions: millimeters 0.26 5x 0.49 6x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.40 1 mounting footprint pkg outline
7sb3126 http://onsemi.com 10 package dimensions ullga6 1.45x1.0, 0.5p case 613af ? 01 issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. a maximum of 0.05 pull back of the plated terminal from the edge of the package is allowed. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view l1 1 3 4 6 dim min max millimeters a ??? 0.40 a1 0.00 0.05 b 0.15 0.25 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.25 0.35 l1 0.30 0.40 note 4 soldermask defined* dimensions: millimeters 0.30 5x 0.49 6x 1.24 0.53 pitch *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint pkg outline on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?t ypicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license un der its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended f or surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in a ny manner. 7sb3126/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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